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NC7SZ126 Datasheet, PDF (1/8 Pages) Fairchild Semiconductor – TinyLogic UHS Buffer with 3-STATE Output
October 1996
Revised May 2003
NC7SZ126
TinyLogic UHS Buffer with 3-STATE Output
General Description
The NC7SZ126 is a single buffer with 3-STATE output from
Fairchild’s Ultra High Speed Series of TinyLogic. The
device is fabricated with advanced CMOS technology to
achieve ultra high speed with high output drive while main-
taining low static power dissipation over a very broad VCC
operating range. The device is specified to operate over
the 1.65V to 5.5V range. The inputs and output are high
impedance above ground when VCC is 0V. Inputs tolerate
voltages up to 6V independent of VCC operating voltage.
The output tolerates voltages above VCC in the 3-STATE
condition.
Features
s Space saving SOT23 or SC70 5-lead package
s Ultra small MicroPak leadless package
s Ultra High Speed; tPD 2.6 ns Typ into 50 pF at 5V VCC
s High Output Drive; ±24 mA at 3V VCC
s Broad VCC Operating Range; 1.65V to 5.5V
s Matches the performance of LCX when operated at
3.3V VCC
s Power down high impedance inputs/output
s Overvoltage tolerant inputs facilitate 5V to 3V
translation
s Patented noise/EMI reduction circuitry implemented
Ordering Code:
Order
Number
NC7SZ126M5X
NC7SZ126P5X
NC7SZ126L6X
Package
Number
MA05B
MAA05A
MAC06A
Product Code
Top Mark
Package Description
7Z26
5-Lead SOT23, JEDEC MO-178, 1.6mm
Z26
5-Lead SC70, EIAJ SC-88a, 1.25mm Wide
FF
6-Lead MicroPak, 1.0mm Wide
Supplied As
3k Units on Tape and Reel
3k Units on Tape and Reel
5k Units on Tape and Reel
Logic Symbol
Connection Diagrams
Pin Assignments for SC70 and SOT23
Pin Descriptions
Pin Names
A, OE
Y
NC
Description
Inputs
Output
No Connect
Function Table
Inputs
Output
OE
A
OUT Y
H
L
L
H
H
H
L
X
Z
H = HIGH Logic Level
L = LOW Logic Level
X = HIGH or LOW Logic Level
Z = HIGH Impedance State
TinyLogic is a registered trademark of Fairchild Semiconductor Corporation.
MicroPak is a trademark of Fairchild Semiconductor Corporation.
© 2003 Fairchild Semiconductor Corporation DS012171
(Top View)
Pad Assignments for MicroPak
(Top Thru View)
www.fairchildsemi.com