ISL9R1560S3S Datasheet, PDF (1/7 Pages) Fairchild Semiconductor – 15A, 600V Stealth™ Diode

Data Sheet
ISL9R1560S3S
May 2001
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15A, 600V Stealth™ Diode
The ISL9R1560S3S is a Stealth™ diode optimized for low
loss performance in high frequency hard switched
applications. The Stealth™ family exhibits low reverse
recovery current (I_RRM) and exceptionally soft recovery
under typical operating conditions.
This device is intended for use as a free wheeling or boost
diode in power supplies and other power switching
applications. The low I_RRM and short t_a phase reduce loss in
switching transistors. The soft recovery minimizes ringing,
expanding the range of conditions under which the diode
may be operated without the use of additional snubber
circuitry. Consider using the Stealth™ diode with an SMPS
IGBT to provide the most efficient and highest power density
design at lower cost.
Formerly developmental type TA49410.
Ordering Information
PART NUMBER
PACKAGE
BRAND
ISL9R1560S3S
TO-263AB
R1560S3S
NOTE: When ordering, use the entire part number.
Symbol
K
Features
• Soft Recovery . . . . . . . . . . . . . . . . . . . . . . . . . t_b / t_a > 1.2
• Fast Recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . t_rr < 30ns
• Operating Temperature . . . . . . . . . . . . . . . . . . . . . . 175^oC
• Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600V
• Avalanche Energy Rated
Applications
• Switch Mode Power Supplies
• Hard Switched PFC Boost Diode
• UPS Free Wheeling Diode
• Motor Drive FWD
• SMPS FWD
• Snubber Diode
Packaging
JEDEC TO-263AB
CATHODE
(FLANGE)
N/C
ANODE
A
Absolute Maximum Ratings T_C = 25^oC, Unless Otherwise Specified
SYMBOL
PARAMETER
ISL9R1560S3S
UNITS
V_RRM
Peak Repetitive Reverse Voltage
V_RWM
Working Peak Reverse Voltage
V_R
DC Blocking Voltage
I_F(AV)
Average Rectified Forward Current
I_FRM
Repetitive Peak Surge Current (20kHz Square Wave)
I_FSM
Nonrepetitive Peak Surge Current (Halfwave 1 Phase 60Hz)
P_D
Power Dissipation
E_AVL
Avalanche Energy (1A, 40mH)
T_J, T_STG
Operating and Storage Temperature
Maximum Temperature for Soldering
T_L
T_pkg
Leads at 0.063in (1.6mm) from Case for 10s
Package Body for 10s, See Techbrief TB334
THERMAL SPECIFICATIONS
R_θJC
R_θJA
NOTES:
Thermal Resistance Junction to Case
Thermal Resistance Junction to Ambient
600
600
600
15
30
200
150
20
-55 to 175
300
260
1.0
62
V
V
V
A
A
A
W
mJ
o_C
o_C
o_C
o_C/W
o_C/W
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
©2001 Fairchild Semiconductor Corporation
ISL9R1560S3S REV A