|
ISL9N304AP3 Datasheet, PDF (1/11 Pages) Fairchild Semiconductor – N-Channel Logic Level UltraFET Trench MOSFETs 30V, 75A, 4.5mΩ | |||
|
February 2002
PWM Optimized
ISL9N304AP3/ISL9N304AS3ST
N-Channel Logic Level UltraFET® Trench MOSFETs
30V, 75A, 4.5mâ¦
General Description
This device employs a new advanced trench MOSFET
technology and features low gate charge while maintaining
low on-resistance.
Features
⢠Fast switching
⢠rDS(ON) = 0.0036⦠(Typ), VGS = 10V
Optimized for switching applications, this device improves
the overall efficiency of DC/DC converters and allows
operation to higher switching frequencies.
⢠rDS(ON) = 0.0060⦠(Typ), VGS = 4.5V
⢠Qg (Typ) = 38nC, VGS = 5V
Applications
⢠DC/DC converters
DRAIN
(FLANGE)
⢠Qgd (Typ) = 13nC
⢠CISS (Typ) = 4075pF
SOURCE
DRAIN
GATE
D
GATE
SOURCE
TO-263
DRAIN
(FLANGE)
TO-220
G
S
MOSFET Maximum Ratings TA = 25°C unless otherwise noted
Symbol
VDSS
VGS
ID
Parameter
Drain to Source Voltage
Gate to Source Voltage
Drain Current
Continuous (TC = 25oC, VGS = 10V)
Continuous (TC = 100oC, VGS = 4.5V)
Continuous (TC = 25oC, VGS = 10V, RθJA = 43oC/W)
Pulsed
PD
Power dissipation
Derate above 25oC
TJ, TSTG Operating and Storage Temperature
Ratings
30
±20
75
74
20
Figure 4
145
0.97
-55 to 175
Units
V
V
A
A
A
A
W
W/oC
oC
Thermal Characteristics
RθJC
RθJA
RθJA
Thermal Resistance Junction to Case TO-220, TO-263
Thermal Resistance Junction to Ambient TO-220, TO-263
Thermal Resistance Junction to Ambient TO-263, 1in2 copper pad area
1.03
62
43
oC/W
oC/W
oC/W
Package Marking and Ordering Information
Device Marking
N304AS
N304AP
Device
ISL9N304AS3ST
ISL9N304AP3
Package
TO-263AB
TO-220AB
Reel Size
330mm
Tube
Tape Width
24mm
N/A
Quantity
800 units
50
©2002 Fairchild Semiconductor Corporation
Rev. B, February 2002
|
▷ |