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HUF76407D3 Datasheet, PDF (1/10 Pages) Fairchild Semiconductor – 11A, 60V, 0.107 Ohm, N-Channel, Logic Level UltraFET Power MOSFET | |||
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Data Sheet
HUF76407D3, HUF76407D3S
December 2001
11A, 60V, 0.107 Ohm, N-Channel, Logic
Level UltraFET® Power MOSFET
Packaging
JEDEC TO-251AA
DRAIN
(FLANGE)
SOURCE
DRAIN
GATE
HUF76407D3
JEDEC TO-252AA
DRAIN
(FLANGE)
GATE
SOURCE
HUF76407D3S
Symbol
D
G
S
Features
⢠Ultra Low On-Resistance
- rDS(ON) = 0.092â¦, VGS = 10V
- rDS(ON) = 0.107â¦, VGS = 5V
⢠Simulation Models
- Temperature Compensated PSPICE® and SABERâ¢
Electrical Models
- Spice and SABER Thermal Impedance Models
- www.fairchildsemi.com
⢠Peak Current vs Pulse Width Curve
⢠UIS Rating Curve
⢠Switching Time vs RGS Curves
Ordering Information
PART NUMBER
PACKAGE
BRAND
HUF76407D3
TO-251AA
76407D
HUF76407D3S
TO-252AA
76407D
NOTE: When ordering, use the entire part number. Add the sufï¬x T to
obtain the TO-252AA variant in tape and reel, e.g., HUF76407D3ST.
Absolute Maximum Ratings TC = 25oC, Unless Otherwise Speciï¬ed
HUF76407D3,
HUF76407D3S
UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS
60
V
Drain to Gate Voltage (RGS = 20kâ¦) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR
60
V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS
±16
V
Drain Current
Continuous (TC = 25oC, VGS = 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID
11
A
Continuous
Continuous
Continuous
(T C
(T C
(T C
=
=
=
21153355oCooCC, V,, VVGGGSSS===1054VV.5))V(.)F.(i.gF.uig.rue.r.2e.)2.)..
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ID
ID
ID
12
6
6
A
A
A
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IDM
Figure 4
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .UIS
Figures 6, 14, 15
Power Dissipation . . .
Derate Above 25oC
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PD
...
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TL
Package Body for 10s, See Techbrief TB334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg
NOTE:
38
0.25
-55 to 175
300
260
W
W/oC
oC
oC
oC
1. TJ = 25oC to 150oC.
CAUTION: Stresses above those listed in âAbsolute Maximum Ratingsâ may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this speciï¬cation is not implied.
For severe environments, see our Automotive HUFA series.
©2001 Fairchild Semiconductor Corporation
HUF76407D3, HUF76407D3S Rev. B
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