English
Language : 

FSAM50SM60A Datasheet, PDF (1/16 Pages) Fairchild Semiconductor – SPMTM (Smart Power Module)
April 3, 2006
FSAM50SM60A
SPMTM (Smart Power Module)
General Description
FSAM50SM60A is an advanced smart power module
(SPM) that Fairchild has newly developed and designed to
provide very compact and low cost, yet high performance
ac motor drives mainly targeting medium speed low-power
inverter-driven application like air conditioners. It combines
optimized circuit protection and drive matched to low-loss
IGBTs. Highly effective short-circuit current detection/
protection is realized through the use of advanced current
sensing IGBT chips that allow continuous monitoring of the
IGBTs current. System reliability is further enhanced by the
built-in over-temperature and integrated under-voltage
lock-out protection. The high speed built-in HVIC provides
opto-coupler-less IGBT gate driving capability that further
reduce the overall size of the inverter system design. In
addition the incorporated HVIC facilitates the use of single-
supply drive topology enabling the FSAM50SM60A to be
driven by only one drive supply voltage without negative
bias. Inverter current sensing application can be achieved
due to the devided nagative dc terminals.
Features
• UL Certified No. E209204
• 600V-50A 3-phase IGBT inverter bridge including control
ICs for gate driving and protection
• Divided negative dc-link terminals for inverter current
sensing applications
• Single-grounded power supply due to built-in HVIC
• Typical switching frequency of 5kHz
• Built-in thermistor for over-temperature monitoring
• Isolation rating of 2500Vrms/min.
• Very low leakage current due to using DBC (Direct
Bonded Copper) substrate
• Adjustable current protection level by varying series
resistor value with sense-IGBTs
Applications
• AC 100V ~ 253V three-phase inverter drive for small
power ac motor drives
• Home appliances applications like air conditioners drive
system
External View
Top View
60mm
31mm
Bottom View
©2006 Fairchild Semiconductor Corporation
Fig. 1.
April 3, 2006