FSA2567_0711 Datasheet, PDF (1/2 Pages) Fairchild Semiconductor – Low-Power, Dual SIM Card Analog Switch

Click to see this datasheet
in Simplified Chinese!
November 2007
FSA2567 — Low-Power, Dual SIM Card Analog Switch
Features
ƒ Low On Capacitance for Data Path: 10pF Typical
ƒ Low On Resistance for Data Path: 6Ω Typical
ƒ Low On Resistance for Supply Path: 0.4Ω Typical
ƒ Low Power Consumption: 1μA Maximum
- 15μA Maximum ICCT Over Expanded Voltage
Range (VIN=1.8V, VCC=4.3V)
ƒ Wide -3db Bandwidth: > 160MHz
ƒ Packaged in:
- Pb-free 16-Lead MLP
- Pb-free 16-Lead UMLP (1.8 x 2.6mm)
ƒ 3kV ESD Rating, >12kV Power/GND ESD Rating
Applications
ƒ Cell phone, PDA, Digital Camera, and Notebook
ƒ LCD Monitor, TV, and Set-Top Box
Description
The FSA2567 is a bi-directional, low-power, dual
double-pole, double-throw (4PDT) analog switch
targeted at dual SIM card multiplexing. It is optimized
for switching the WLAN-SIM data and control signals
and dedicates one channel as a supply-source switch.
The FSA2567 is compatible with the requirements of
SIM cards and features a low on capacitance (CON) of
10pF to ensure high-speed data transfer. The VSIM
switch path has a low RON characteristic to ensure
minimal voltage drop in the dual SIM card supply paths.
The FSA2567 contains special circuitry that minimizes
current consumption when the control voltage applied to
the SEL pin is lower than the supply voltage (VCC). This
feature is especially valuable in ultra-portable
applications, such as cell phones; allowing direct
interface with the general-purpose I/Os of the baseband
processor. Other applications include switching and
connector sharing in portable cell phones, PDAs, digital
cameras, printers, and notebook computers.
IMPORTANT NOTE:
For additional performance information, please contact
[e-mail].
Ordering Information
Part Number
Top Mark
Operating Temperature
Range
Package
FSA2567MPX
FSA2567UMX
FSA2567
GX
-40 to +85°C
-40 to +85°C
16-Lead, Molded Leadless Package (MLP) Quad,
JEDEC MO-220, 3mm Square
16-Lead, Quad, Ultrathin Molded Leadless
Package (UMLP), 1.8 x 2.6mm
All packages are lead free per JEDEC: J-STD-020B standard.
© 2007 Fairchild Semiconductor Corporation
FSA2567 Rev. 1.0.1
1V_SIM
2V_SIM
1RST
2RST
1CLK
2CLK
1DAT
2DAT
V_SIM
RST
CLK
DAT
Sel
Figure 1. Analog Symbol
www.fairchildsemi.com