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FQD17N08LTM Datasheet, PDF (1/8 Pages) Fairchild Semiconductor – N-Channel QFET® MOSFET 80 V, 12.9 A, 100 mΩ | |||
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FQD17N08L
N-Channel QFET® MOSFET
80 V, 12.9 A, 100 mâ¦
November 2013
Description
This N-Channel enhancement mode power MOSFET is
produced using Fairchild Semiconductorâs proprietary planar
stripe and DMOS technology. This advanced MOSFET
technology has been especially tailored to reduce on-state
resistance, and to provide superior switching performance
and high avalanche energy strength. These devices are
suitable for switched mode power supplies, audio amplifier,
DC motor control, and variable switching power applications.
Features
⢠12.9 A, 80 V, RDS(on) = 100 m⦠(Max.) @ VGS = 10 V,
ID = 6.45 A
⢠Low Gate Charge (Typ. 8.8 nC)
⢠Low Crss (Typ. 29 pF)
⢠100% Avalanche Tested
D
D
G
S
D-PAK
G
S
Absolute Maximum Ratings TC = 25°C unless otherwise noted.
Symbol
Parameter
VDSS
ID
IDM
VGSS
EAS
IAR
EAR
dv/dt
PD
Drain-Source Voltage
Drain Current
- Continuous (TC = 25°C)
- Continuous (TC = 100°C)
Drain Current - Pulsed
Gate-Source Voltage
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation (TA = 25°C) *
Power Dissipation (TC = 25°C)
- Derate above 25°C
(Note 1)
(Note 2)
(Note 1)
(Note 1)
(Note 3)
TJ, TSTG
TL
Operating and Storage Temperature Range
Maximum lead temperature for soldering,
1/8" from case for 5 seconds
FQD17N08LTM
80
12.9
8.2
51.6
± 20
100
12.9
4.0
6.5
2.5
40
0.32
-55 to +150
300
Unit
V
A
A
A
V
mJ
A
mJ
V/ns
W
W
W/°C
°C
°C
Thermal Characteristics
Symbol
Parameter
Rï±JC
Rï±JA
Thermal Resistance, Junction to Case, Max.
Thermal Resistance, Junction to Ambient (Minimum Pad of 2-oz Copper), Max.
Thermal Resistance, Junction to Ambient (*1 in2 Pad of 2-oz Copper), Max.
FQD17N08LTM
3.13
110
50
Unit
oC/W
©2000 Fairchild Semiconductor Corporation
1
FQD17N08L Rev. C1
www.fairchildsemi.com
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