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FPF3040 Datasheet, PDF (1/12 Pages) Fairchild Semiconductor – IntelliMAX™ 20 V-Rated Dual Input Single Output Power-Source-Selector Switch | |||
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September 2012
FPF3040
IntelliMAX⢠20 V-Rated Dual Input Single Output
Power-Source-Selector Switch
Features
ï§ Dual-Input, Single-Output Load Switch
ï§ Input Supply Operating Range:
- 4~10.5 V at VIN
- 4~6.5 V at VBUS
ï§ Typical RON:
- 95 m⦠at VIN=5 V
- 70 m⦠at VBUS=5 V
ï§ Bi-Directional Switch for VIN and VBUS
ï§ Slew Rate Controlled:
- 50 µs at VIN for < 4.7 µF COUT
- 90 µs at VBUS for < 4.7 µF COUT
ï§ Maximum ISW: 2 A Per Channel
ï§ Break-Before-Make Transition
ï§ Under-Voltage Lockout (UVLO)
ï§ Over-Voltage Lockout (OVLO)
ï§ Thermal Shutdown
ï§ Logic CMOS IO Meets JESD76 Standard for GPIO
Interface and Related Power Supply Requirements
ï§ ESD Protected:
- Human Body Model: >3 kV
- Charged Device Model: >1.5 kV
- IEC 61000-4-2 Air Discharge: >15 kV
- IEC61000-4-2 Contact Discharge: >8 kV
Applications
ï§ Input Power Selection Block Supporting USB and
Wireless Charging
ï§ Smartphone / Tablet PC
Description
The FPF3040 is a 20 V-rated Dual-Input Single-Output
(DISO) load switch consisting of two channels of slew-
rate-controlled, low-on-resistance, N-channel MOSFET
switches with protection features. The slew-rate-
controlled turn-on characteristic prevents inrush current
and the resulting excessive voltage droop on the input
power rails. The input voltage range operates from
4 V to 6.5 V at VBUS and from 4 V to 10.5 V at VIN to
align with the needs of low-voltage portable device
power rails.
VIN and VBUS have the over-voltage protection
functionality of typical 12 V and 7.5 V, respectively, to
avoid unwanted damage to system.
VIN and VBUS bi-directional switching allows reverse
current from VOUT to VIN or VBUS for On-The-Go, (OTG)
Mode. The switching is controlled by logic input EN and
VIN_SEL is capable of interfacing directly with low-voltage
control signal General-Purpose Input / Output (GPIO).
FPF3040 is available in 1.8 mm x 2.0 mm Wafer-Level
Chip-Scale Package (WLCSP), 16-bump, 0.4 mm pitch.
Ordering Information
Part Number
FPF3040UCX
Top
Mark
QY
Channel
DISO
Typical RON per
Channel at 5VIN
95 m⦠for VIN
70 m⦠for VBUS
Rise Time (tR)
Package
50 µs for VIN 1.8 mm x 2.0 mm Wafer-Level Chip-Scale
90 µs for VBUS Package (WLCSP), 16-Bump, 0.4 mm Pitch
© 2012 Fairchild Semiconductor Corporation
FPF3040 ⢠Rev. 2.4.0
www.fairchildsemi.com
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