FPF3003 Datasheet, PDF (1/3 Pages) Fairchild Semiconductor – IntelliMAX™ Full Functional Input Power Path Management Switch for Dual-Battery Portable System

July 2012
FPF3003
IntelliMAX™ Full Functional Input Power Path
Management Switch for Dual-Battery Portable System
Features
 2.3V to 5.5V Input Voltage Operating Range
 Low R_ON between Battery and Load
Maximum 50mΩ at V_IN = 4.2V
 Low R_ON between Charger and Battery
Maximum 125mΩ at V_IN = 4.2V
 Maximum DC Current for Load Switch: 2.5A
 Maximum DC Current for Charge Switch: 1.5A
 Slew Rate Controlled to 30µs Nominal Rise Time
 Seamless Break-Before-Make Transition
 Quiescent Current: 30µA Typical
 Thermal Shutdown
 Reverse Current Blocking (RCB) between Battery A
and Battery B
 RESET Timer Delay: 7s Typical
 ESD Protected:
- Human Body Model: >2.5kV
- Charged Device Model: >1.5kV
- IEC 61000-4-2 Air Discharge: >15kV
- IEC 61000-4-2 Contact Discharge: >8kV
 1.6mm X 1.6mm, 16-Bump, 0.4mm Pitch, WLCSP
Applications
 Dual-Battery Cell phone
 Dual-Battery Portable Equipment
Description
The FPF3003 is a single-chip solution for dual-battery
power-path switching, including integrated P-channel
switches and analog control features. The input voltage
range operates from 2.3V to 5.5V. The device selects
one of two batteries to provide power to the system,
enabling one battery to be charged by the external
battery charger.
The FPF3003 has battery voltage monitoring to
determine if the battery is under voltage. Special driver
and digital circuitry allows the device to switch quickly
between battery A and battery B, which allows hot
swapping of battery packs. Maximum current from
battery to load per channel is limited to a constant 2.5A
and internal thermal shutdown circuits protect the part
during fault conditions.
The FPF3003 is available in a 1.6mm x 1.6mm,
16-bump, Wafer-Level Chip-Scale Package (WLCSP).
Ordering Information
Part Number Top Mark
(Charger-Battery)
Max. R_ON at 4.2V_IN
FPF3003UCX
QW
125mΩ
(Battery-Load)
Max. R_ON at 4.2V_IN
50mΩ
Typical
t_R
Package
30µs
16-Bump, 0.4mm Pitch,
1.6mm x 1.6mm WLCSP
© 2011 Fairchild Semiconductor Corporation
FPF3003 • Rev. 1.0.0
www.fairchildsemi.com