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FDZ299P Datasheet, PDF (1/6 Pages) Fairchild Semiconductor – P-Channel 2.5 V Specified PowerTrench BGA MOSFET | |||
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February 2004
FDZ299P
P-Channel 2.5 V Specified PowerTrench® BGA MOSFET
General Description
Combining Fairchildâs advanced 2.5V specified
PowerTrench process with state of the art BGA
packaging, the FDZ299P minimizes both PCB space
and RDS(ON). This BGA MOSFET embodies a
breakthrough in packaging technology which enables
the device to combine excellent thermal transfer
characteristics, high current handling capability, ultra-
low profile packaging, low gate charge, and low RDS(ON).
Applications
⢠Battery management
⢠Load switch
⢠Battery protection
Features
⢠â4.6 A, â20 V
RDS(ON) = 55 m⦠@ VGS = â4.5 V
RDS(ON) = 80 m⦠@ VGS = â2.5 V
⢠Occupies only 2.25 mm2 of PCB area.
Less than 50% of the area of a SSOT-6
⢠Ultra-thin package: less than 0.80 mm height when
mounted to PCB
⢠Outstanding thermal transfer characteristics:
4 times better than SSOT-6
⢠Ultra-low Qg x RDS(ON) figure-of-merit
⢠High power and current handling capability.
S
G
Bottom
Top
Absolute Maximum Ratings TA=25oC unless otherwise noted
Symbol
VDSS
VGSS
ID
Parameter
Drain-Source Voltage
Gate-Source Voltage
Drain Current â Continuous
â Pulsed
(Note 1a)
PD
TJ, TSTG
Power Dissipation for Single Operation
(Note 1a)
Operating and Storage Junction Temperature Range
Thermal Characteristics
RθJA
Thermal Resistance, Junction-to-Ambient (Note 1a)
Package Marking and Ordering Information
Device Marking
Device
Reel Size
B
FDZ299P
7â
D
Ratings
â20
±12
â4.6
â10
1.7
â55 to +150
72
Tape width
8mm
Units
V
V
A
W
°C
°C/W
Quantity
3000 units
©2004 Fairchild Semiconductor Corporation
FDZ299P Rev C6 (W)
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