FDPC4044 Datasheet, PDF (1/7 Pages) Fairchild Semiconductor – Common Drain N-Channel PowerTrench MOSFET

FDPC4044
Common Drain N-Channel PowerTrench^® MOSFET
August 2014
30 V, 27 A, 4.3 mΩ
Features
„ Max r_S1S2(on) = 4.3 mΩ at V_GS = 10 V, I_S1S2 = 27 A
„ Max r_S1S2(on) = 6.4 mΩ at V_GS = 4.5 V, I_S1S2 = 23 A
„ Pakage size/height: 3.3 x 3.3 x 0.8 mm
„ Low inductance packaging shortens rise/fall times, resulting in
lower switching losses
„ MOSFET integration enables optimum layout for lower circuit
inductance and reduced switch node ringing
„ RoHS Compliant
General Description
This device is designed specifically as a single package solution
for Li-Ion battery pack protection circuit and other ultra-portable
applications. It features two common drain N-channel
MOSFETs, which enables bidirectional current flow. FDPC4044
combines Fairchild’s advanced PowerTrench^® process with
state of the art packaging process to minimize the on-state
resistance.
Applications
„ Battery management
„ Load switch
„ Battery protection
S2
S2
S2
S1
S1
S1
G2
D2
D1
G1
Pin 1
Pin 1
S1
G1
G2
Bottom
Top
S2
Power Clip 33
MOSFET Maximum Ratings T_A = 25 °C unless otherwise noted
Symbol
V_S1S2
V_GS
I_S1S2
P_D
T_J, T_STG
Parameter
Source1 to Source2 Voltage
Gate to Source Voltage
Source1 to Source2 Current -Continuous T_A = 25 °C
-Pulsed
Power Dissipation
T_A = 25 °C
Power Dissipation
T_A = 25 °C
Operating and Storage Junction Temperature Range
Thermal Characteristics
(Note 3)
(Note 1a)
(Note 2)
(Note 1a)
(Note 1b)
Ratings
30
±20
27
120
2.7
1
-55 to +150
Units
V
V
A
W
°C
R_θJA
R_θJA
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Package Marking and Ordering Information
(Note 1a)
47
(Note 1b)
127
°C/W
Device Marking
40CF
Device
FDPC4044
Package
Power Clip 33
Reel Size
13 ”
Tape Width
12 mm
Quantity
3000 units
©2013 Fairchild Semiconductor Corporation
1
FDPC4044 Rev.C2
www.fairchildsemi.com