FDP52N20 Datasheet, PDF (1/10 Pages) Fairchild Semiconductor – 200V N-Channel MOSFET

FDP52N20 / FDPF52N20T
N-Channel MOSFET
200V, 52A, 0.049Ω
Features
• R_DS(on) = 0.041Ω ( Typ.)@ V_GS = 10V, I_D = 26A
• Low gate charge ( Typ. 49nC)
• Low C_rss ( Typ. 66pF)
• Fast switching
• 100% avalanche tested
• Improve dv/dt capability
• RoHS compliant
October 2007
UniFET^TM
tm
Description
These N-Channel enhancement mode power field effect transis-
tors are produced using Fairchild’s proprietary, planar stripe,
DMOS technology.
This advance technology has been especially tailored to mini-
mize on-state resistance, provide superior switching perfor-
mance, and withstand high energy pulse in the avalanche and
commutation mode. These devices are well suited for high effi-
cient switching mode power supplies and active power factor
correction.
D
G
G DS
TO-220
FDP Series
GD S
TO-220F
FDPF Series
S
MOSFET Maximum Ratings T_C = 25^oC unless otherwise noted
Symbol
Parameter
V_DSS
V_GSS
I_D
I_DM
E_AS
I_AR
E_AR
dv/dt
P_D
Drain to Source Voltage
Gate to Source Voltage
Drain Current
Drain Current
-Continuous (T_C = 25^oC)
-Continuous (T_C = 100^oC)
- Pulsed
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation
(T_C = 25^oC)
- Derate above 25^oC
T_J, T_STG
Operating and Storage Temperature Range
T_L
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
*Drain current limited by maximum junction temperature
Thermal Characteristics
(Note 1)
(Note 2)
(Note 1)
(Note 1)
(Note 3)
FDP52N20 FDPF52N20T
200
±30
52
52*
33
33*
208
208*
2520
52
35.7
4.5
357
38.5
2.86
0.3
-55 to +150
300
Units
V
V
A
A
mJ
A
mJ
V/ns
W
W/^oC
o_C
o_C
Symbol
R_θJC
R_θCS
R_θJA
Parameter
Thermal Resistance, Junction to Case
Thermal Resistance, Case to Sink Typ.
Thermal Resistance, Junction to Ambient
FDP52N20
0.35
0.5
62.5
FDPF52N20T
3.3
-
62.5
Units
o_C/W
©2007 Fairchild Semiconductor Corporation
1
FDP52N20 / FDPF52N20T Rev. A
www.fairchildsemi.com