FDP15N65_0610 Datasheet, PDF (1/10 Pages) Fairchild Semiconductor – 650V N-Channel MOSFET

FDP15N65 / FDPF15N65
650V N-Channel MOSFET
Features
• 15A, 650V, R_DS(on) = 0.44Ω @V_GS = 10 V
• Low gate charge ( typical 48.5 nC)
• Low C_rss ( typical 23.6 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
October 2006
UniFET ^TM
Description
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary, planar
stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the avalanche
and commutation mode. These devices are well suited for high
efficient switched mode power supplies and active power factor
correction.
D
GDS
TO-220
FDP Series
GD S
G
TO-220F
FDPF Series
S
Absolute Maximum Ratings
Symbol
Parameter
V_DSS
I_D
I_DM
V_GSS
E_AS
I_AR
E_AR
dv/dt
P_D
T_J, T_STG
T_L
Drain-Source Voltage
Drain Current
Drain Current
- Continuous (T_C = 25°C)
- Continuous (T_C = 100°C)
- Pulsed
(Note 1)
Gate-Source voltage
Single Pulsed Avalanche Energy
(Note 2)
Avalanche Current
(Note 1)
Repetitive Avalanche Energy
(Note 1)
Peak Diode Recovery dv/dt
(Note 3)
Power Dissipation
(T_C = 25°C)
- Derate above 25°C
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
* Drain current limited by maximum junction termperature.
FDP15N65 FDPF15N65
650
15
15*
9.5
9.5*
60
60*
± 30
637
15
25.0
4.5
250
73.5
2.0
0.59
-55 to +150
300
Thermal Characteristics
Symbol
R_θJC
R_θCS
R_θJA
Parameter
Thermal Resistance, Junction-to-Case
Thermal Resistance, Case-to-Sink
Thermal Resistance, Junction-to-Ambient
FDP15N65
0.5
0.5
62.5
FDPF15N65
1.7
--
62.5
Unit
V
A
A
A
V
mJ
A
mJ
V/ns
W
W/°C
°C
°C
Unit
°C/W
°C/W
°C/W
©2006 Fairchild Semiconductor Corporation
1
FDP15N65 / FDPF15N65 Rev. A
www.fairchildsemi.com