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FDMS9620S Datasheet, PDF (1/9 Pages) Fairchild Semiconductor – Dual N-Channel PowerTrench® MOSFET Q1: 30V, 16A, 21.5mΩ Q2: 30V, 18A, 13mΩ
April 2007
FDMS9620S
Dual N-Channel PowerTrench® MOSFET
tm
Q1: 30V, 16A, 21.5mΩ Q2: 30V, 18A, 13mΩ
Features
General Description
Q1: N-Channel
„ Max rDS(on) = 21.5mΩ at VGS = 10V, ID = 7.5A
„ Max rDS(on) = 29.5mΩ at VGS = 4.5V, ID = 6.5A
Q2: N-Channel
„ Max rDS(on) = 13mΩ at VGS = 10V, ID = 10A
„ Max rDS(on) = 17mΩ at VGS = 4.5V, ID = 8.5A
„ Low Qg high side MOSFET
„ Low rDS(on) low side MOSFET
„ Thermally efficient dual Power 56 package
This device includes two specialized MOSFETs in a unique dual
Power 56 package. It is designed to provide an optimal
Synchronous Buck power stage in terms of efficiency and PCB
utilization. The low switching loss "High Side" MOSFET is
complemented by a Low Conduction Loss "Low Side" SyncFET.
Application
Synchronous Buck Converter for:
„ Notebook System Power
„ General Purpose Point of Load
„ Pinout optimized for simple PCB design
„ RoHS Compliant
G1
D1
D1
D1
D1
S1/D2
G2
S2
S2
S2
Power 56
5
Q2
6
7
8
4
3
2
Q1
1
MOSFET Maximum Ratings TA = 25°C unless otherwise noted
Symbol
VDS
VGS
ID
PD
TJ, TSTG
Parameter
Drain to Source Voltage
Gate to Source Voltage
Drain Current
-Continuous (Package limited) TC = 25°C
-Continuous (Silicon limited) TC = 25°C
-Continuous
TA = 25°C
-Pulsed
Power Dissipation for Single Operation
TA = 25°C
TA = 25°C
Operating and Storage Junction Temperature Range
Thermal Characteristics
(Note 1a)
(Note 1a)
(Note 1b)
Q1
Q2
30
30
±20
±20
16
18
21
44
7.5
10
60
60
2.5
1
-55 to +150
Units
V
V
A
W
°C
RθJA
RθJA
RθJC
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case
Package Marking and Ordering Information
(Note 1a)
(Note 1b)
50
120
8.2
3.1
°C/W
Device Marking
FDMS9620S
Device
FDMS9620S
Package
Power 56
Reel Size
13”
Tape Width
12mm
Quantity
3000 units
©2007 Fairchild Semiconductor Corporation
1
FDMS9620S Rev.D
www.fairchildsemi.com