FDMS8570SDC Datasheet, PDF (1/2 Pages) Fairchild Semiconductor – DUAL COOL™ PACKAGE POWERTRENCH® MOSFETs

DUAL COOL^™ PACKAGE POWERTRENCH^® MOSFETs
Dual Cool^™ packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is
the PQFN footprint an industry standard, it provides the designer with performance flexibility. With enhanced dual
path thermal performance and improved parasitics over its wire-bonded predecessors, the use of a heat sink with
Dual Cool packaging technology provides even more impressive results. Test results prove that, when a heat sink
is used with our Dual Cool package technology, synchronous buck converters deliver higher output current and
increased power density. With Fairchild’s trench silicon technology, Dual Cool packaging technology proves to be a
clear leader in power density and thermal performance. Our Dual Cool package solutions are lead free and RoHS
compliant and are available in 3.3 mm x 3.3 mm and 5 mm x 6 mm PQFN packages.
Features
• Top-side cooling, lower thermal resistance from
junction to top
• Same land pattern as 5 mm x 6 mm and
3.3 mm x 3.3 mm PQFN – JEDEC standard
• Allows higher current and power dissipation
• Highest power density for DC-DC applications
• Use with or without a heat sink, reduces the
number of qualified components in the BOM
• Multiple suppliers without cross licensing
requirements
• High degree of production commonality with
standard PQFN packaging
• 25 V - 150 V portfolio
Applications
• Point-of-load (POL) synchronous-buck conversion
• Servers
• Telecommunications, routing and switching
• Heat path from top only
5mm x 6mm Package
Interconnect
PQFN Wire
PQFN Clip
Dual Cool Package
Environment: Minimum Pad, Heat Sink, 200LFM Forced Air
Q_JA(°C/W)
27.1
23.8
17.2
Top
Bottom
3.3 mm x 3.3 mm
&
5 mm x 6 mm
Maximum Power Dissipation
Capable of >60% Better Thermal Performance
Dual Cool Package
3.3mm x 3.3mm
Standard PQFN
3.3mm x 3.3mm
Air Flow =
200LFM
No Air Flow
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Power Loss (W) T_J Max. = 90°C, T_a=50°C
(%) Improvement from Wire Package
-
13.9
57.5
fairchildsemi.com