FDMS2502SDC Datasheet, PDF (1/2 Pages) Fairchild Semiconductor – DUAL COOL™ PACKAGED POWERTRENCH® MOSFETS

DUAL COOL^™ PACKAGED POWERTRENCH^® MOSFETS
Fairchild’s Offering
Dual Cool^™ packaging, our latest innovation, provides both bottom and topside cooling in a PQFN package.
Not only is the PQFN an industry standard, but it also gives the designer performance flexibility within its standard
PQFN footprint. With enhanced dual path thermal performance and improved parasitics over its wire-bonded
predecessors, the use of a heat sink with Dual Cool packaging provides even more impressive results. Test results
show a heat sinked Dual Cool package allows synchronous Buck converters to deliver higher output current, thus
increasing power density. With Fairchild’s world-class trench silicon technology, Dual Cool packaging proves to be
a clear leader in power density and thermal performance. Dual Cool package products are green, lead-free, and
RoHS compliant; and are now available in 3.3mm x 3.3mm and 5mm x 6mm QFN packages.
Features & Benefits
• Top Side Cooling – lower thermal resistance from
junction to top
• Same land pattern as 5mm x 6mm and
3.3mm x 3.3mm PQFN – JEDEC standard
• Allows higher current and power dissipation
• Highest power density for DC-DC applications
• Use with or without a heat sink, reduces the
number of qualified components in the BOM
• Multiple suppliers without cross licensing
requirements
• High degree of production commonality with
standard PQFN packaging
Applications
• Point-of-Load (POL) synchronous Buck conversion
• Desktop, notebook, and server
• Telecommunications, routing, and switching
Top
Bottom
3.3mm x 3.3mm
&
5mm x 6mm
Maximum Power Dissipation
Capable of >60% Better Thermal Performance
Dual Cool Package
3.3mm x 3.3mm
Standard PQFN
3.3mm x 3.3mm
Air Flow =
200LFM
No Air Flow
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Power Loss (W) T_J Max. = 90°C, T_a=50°C
5mm x 6mm² Package
Interconnect
PQFN Wire
PQFN Clip
Dual Cool Package
Q_JA(°C/W)
27.1
23.8
17.2
% Improvement from Wire Package
-
13.9%
57.5%
Environment: Minimum Pad, Heat sink, 200LFM Forced Air
Saving our world, 1mW at a time^™
www.fairchildsemi.com