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FDI9406_F085 Datasheet, PDF (1/6 Pages) Fairchild Semiconductor – N-Channel PowerTrench® MOSFET | |||
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June 2014
FDI9406_F085
N-Channel PowerTrench® MOSFET
40 V, 110 A, 2.2 mΩ
D
Features
 Typ RDS(on) = 1.73mΩ at VGS = 10V, ID = 80A
 Typ Qg(tot) = 107nC at VGS = 10V, ID = 80A
 UIS Capability
 RoHS Compliant
 Qualified to AEC Q101
Applications
 Automotive Engine Control
 Powertrain Management
 Solenoid and Motor Drivers
 Electronic Steering
 Integrated Starter/Alternator
 Distributed Power Architectures and VRM
 Primary Switch for 12V Systems
G
TO-262AB
S
FDI SERIES
For current package drawing, please refer to the Fairchild
website at www.fairchildsemi.com/packaging
MOSFET Maximum Ratings TJ = 25°C unless otherwise noted
Symbol
Parameter
VDSS
VGS
ID
Drain-to-Source Voltage
Gate-to-Source Voltage
Drain Current - Continuous (VGS=10) (Note 1)
Pulsed Drain Current
EAS
Single Pulse Avalanche Energy
Power Dissipation
PD
Derate above 25oC
TJ, TSTG Operating and Storage Temperature
RθJC
Thermal Resistance, Junction to Case
RθJA
Maximum Thermal Resistance, Junction to Ambient
TC = 25°C
TC = 25°C
(Note 2)
(Note 3)
Ratings
40
±20
110
See Figure 4
174
176
1.18
-55 to + 175
0.85
43
Units
V
V
A
mJ
W
W/oC
oC
oC/W
oC/W
Package Marking and Ordering Information
Device Marking
Device
FDI9406
FDI9406_F085
Package
TO-262AB
Reel Size
Tube
Tape Width
N/A
Quantity
50 units
Notes:
1: Current is limited by bondwire configuration.
2: Starting TJ = 25°C, L = 0.045mH, IAS = 88A, VDD = 40V during inductor charging and VDD = 0V during time in avalanche.
3: RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder
mounting surface of the
rating presented here is
bdarasiendpoinnsm. oRuθnJtCingisognuaar1aninte2epdadbyofd2eoszigcnowppheiler.
RθJAis
determined
by
the
user's
board
design.
The maximum
©2014 Fairchild Semiconductor Corporation
1
FDI9406_F085 Rev. C3
www.fairchildsemi.com
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