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FDD9409_F085 Datasheet, PDF (1/6 Pages) Fairchild Semiconductor – N-Channel PowerTrench® MOSFET
May 2014
FDD9409_F085
N-Channel PowerTrench® MOSFET
40 V, 90 A, 3.2 mΩ
D
Features
„ Typ RDS(on) = 2.3mΩ at VGS = 10V, ID = 80A
„ Typ Qg(tot) = 42nC at VGS = 10V, ID = 80A
„ UIS Capability
„ RoHS Compliant
„ Qualified to AEC Q101
Applications
„ Automotive Engine Control
„ Powertrain Management
„ Solenoid and Motor Drivers
„ Electronic Steering
„ Integrated Starter/Alternator
„ Distributed Power Architectures and VRM
„ Primary Switch for 12V Systems
D
G
G
S
DTO-P-2A5K2
(TO-252)
S
For current package drawing, please refer to the Fairchild
website at www.fairchildsemi.com/packaging
MOSFET Maximum Ratings TJ = 25°C unless otherwise noted.
Symbol
Parameter
VDSS
VGS
ID
Drain-to-Source Voltage
Gate-to-Source Voltage
Drain Current - Continuous (VGS=10) (Note 1)
Pulsed Drain Current
EAS
Single-Pulse Avalanche Energy
Power Dissipation
PD
Derate Above 25oC
TJ, TSTG Operating and Storage Temperature
RθJC
Thermal Resistance, Junction to Case
RθJA
Maximum Thermal Resistance, Junction to Ambient
TC = 25°C
TC = 25°C
(Note 2)
(Note 3)
Ratings
40
±20
90
See Figure 4
101
150
1
-55 to + 175
1
52
Units
V
V
A
mJ
W
W/oC
oC
oC/W
oC/W
Package Marking and Ordering Information
Device Marking
Device
Package
FDD9409
FDD9409_F085 D-PAK(TO-252)
Reel Size
13”
Tape Width
12mm
Quantity
2500 units
Notes:
1: Current is limited by bondwire configuration.
2: Starting TJ = 25°C, L = 0.1mH, IAS = 44A, VDD = 40V during inductor charging and VDD = 0V during time in avalanche.
3: RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder
mounting surface of the
rating presented here is
bdarasiendpoinnsm. oRuθnJtiCngisognuaar1aninte2epdadbyofd2eoszigcnowppheiler.
RθJAis
determined
by
the
user's
board
design.
The maximum
©2014 Fairchild Semiconductor Corporation
1
FDD9409_F085 Rev. C4
www.fairchildsemi.com