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FDB9403 Datasheet, PDF (1/6 Pages) Fairchild Semiconductor – N-Channel Power Trench® MOSFET 40V, 110A, 1.2mΩ
FDB9403_F085
N-Channel Power Trench® MOSFET
40V, 110A, 1.2mΩ
Features
„ Typ rDS(on) = 1mΩ at VGS = 10V, ID = 80A
„ Typ Qg(tot) = 164nC at VGS = 10V, ID = 80A
„ UIS Capability
„ RoHS Compliant
„ Qualified to AEC Q101
Applications
„ Automotive Engine Control
„ Powertrain Management
„ Solenoid and Motor Drivers
„ Electronic Steering
„ Integrated Starter/alternator
„ Distributed Power Architectures and VRM
„ Primary Switch for 12V Systems
D
GS
TO-263AB
FDB SERIES
MOSFET Maximum Ratings TJ = 25°C unless otherwise noted
Symbol
Parameter
VDSS
VGS
ID
Drain to Source Voltage
Gate to Source Voltage
Drain Current - Continuous (VGS=10) (Note 1)
Pulsed Drain Current
EAS
Single Pulse Avalanche Energy
Power Dissipation
PD
Derate above 25oC
TJ, TSTG Operating and Storage Temperature
RθJC
Thermal Resistance Junction to Case
RθJA
Maximum Thermal Resistance Junction to Ambient
TC = 25°C
TC = 25°C
(Note 2)
(Note 3)
July
2012
D
G
S
Ratings
40
±20
110
See Figure4
704
333
2.22
-55 to + 175
0.45
43
Units
V
V
A
mJ
W
W/oC
oC
oC/W
oC/W
Package Marking and Ordering Information
Device Marking
Device
FDB9403
FDB9403_F085
Package
TO-263AB
Reel Size
330mm
Tape Width
24mm
Quantity
800 units
Notes:
1: Current is limited by bondwire configuration.
2: Starting TJ = 25°C, L = 0.18mH, IAS = 88A, VDD = 40V during inductor charging and VDD = 0V during time in avalanche
3: RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder
mounting surface
presented here is
obfatsheeddoraninmpoiunnst.inRgθoJnCais1giuna2rpaandteoefd2boyzdceospigpnerw. hile
RθJAis
determined
by
the
user's
board
design.
The maximum rating
©2012 Fairchild Semiconductor Corporation
1
FDB9403_F085_F085 Rev. B1
www.fairchildsemi.com