FCP16N60 Datasheet, PDF (1/10 Pages) Fairchild Semiconductor – 600V N-Channel MOSFET

FCP16N60 / FCPF16N60
600V N-Channel MOSFET
Features
• 650V @T_J = 150°C
• Typ. Rds(on)=0.22:
• Ultra low gate charge (typ. Qg=45nC)
• Low effective output capacitance (typ. Coss.eff=110pF)
• 100% avalanche tested
January 2007
SuperFET^TM
Description
SuperFET^TM is, Farichild’s proprietary, new generation of high
voltage MOSFET family that is utilizing an advanced charge
balance mechanism for outstanding low on-resistance and
lower gate charge performance. 
This advanced technology has been tailored to minimize
conduction loss, provide superior switching performance, and
withstand extreme dv/dt rate and higher avalanche energy.
Consequently, SuperFET is very suitable for various AC/DC
power conversion in switching mode operation for system
miniaturization and higher efficiency.
D
GDS
TO-220
FCP Series
GD S
G
TO-220F
FCPF Series
S
Absolute Maximum Ratings
Symbol
V_DSS
I_D
I_DM
V_GSS
E_AS
I_AR
E_AR
dv/dt
P_D
T_J, T_STG
T_L
Parameter
Drain-Source Voltage
Drain Current
Drain Current
- Continuous (T_C = 25qC)
- Continuous (T_C = 100qC)
- Pulsed
(Note 1)
Gate-Source voltage
Single Pulsed Avalanche Energy
(Note 2)
Avalanche Current
(Note 1)
Repetitive Avalanche Energy
(Note 1)
Peak Diode Recovery dv/dt
(Note 3)
Power Dissipation
(T_C = 25qC)
- Derate above 25qC
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
^{*Drain current limited by maximum junction temperature}
Thermal Characteristics
FCP16N60 FCPF16N60
600
16
16*
10.1
10.1*
48
48*
r 30
tbd
16
20.8
4.5
167
37.9
1.33
0.3
-55 to +150
300
Symbol
R_TJC
R_TJA
Parameter
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient
FCP16N60
0.75
62.5
FCPF16N60
3.3
62.5
Unit
V
A
A
A
V
mJ
A
mJ
V/ns
W
W/qC
qC
qC
Unit
qC/W
qC/W
©2007 Fairchild Semiconductor Corporation
1
FCP16N60 / FCPF16N60 Rev. A
www.fairchildsemi.com