AN-9080 Datasheet, PDF (1/28 Pages) Fairchild Semiconductor – Motion SPM 5 Series Version 2 User’s Guide

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AN-9080
Motion SPM^® 5 Series Version 2 User’s Guide
Table of Contents
1. Introduction ............................................................. 2
1.1 About this Application Note ......................... 2
1.2 Design Concept............................................. 2
1.3 Features......................................................... 2
2. Product Selections ................................................... 3
2.1 Ordering Information .................................... 3
2.2 Product Line-up ............................................ 3
2.3 SPM5 Version Comparison .......................... 3
3. Package.................................................................... 4
3.1 Internal Circuit Diagram ............................... 4
3.2 Pin Description ............................................. 4
3.3 Package Structure ......................................... 5
3.4 Package Outline ............................................ 6
3.5 Marking Specification................................... 7
4. Integrated Functions and Protection Circuit .......... 11
4.1 Internal Structure of HVIC ......................... 11
4.2 Circuit of Input Signal (V_IN(H), V_IN(L))......... 11
4.3 Functions vs. Control Supply Voltage ........ 11
4.4 Under-Voltage Protection ........................... 12
5. New Key Parameter Design Guidance...................13
5.1 Thermal Sensing Unit (TSU) ......................13
5.2 Bootstrap Circuit Design.............................14
5.3 Minimum Pulse Width ................................17
5.4 Short Circuit SOA .......................................17
6. Application Example .............................................18
6.1 General Application Circuit Examples........18
6.2 Recommended Wiring of Shunt Resistor....19
6.3 Snubber Capacitor .......................................19
6.4 PCB Layout Guidance.................................19
6.5 Heatsink Mounting......................................20
6.6 System Performance....................................21
7. Handling Guide and Packing Information .............22
7.1 Handling Precaution....................................22
7.2 Packing Specification..................................23
8. Related Resources..................................................28
© 2013 Fairchild Semiconductor Corporation
Rev. 1.0.1 • 4/16/14
www.fairchildsemi.com