AN-9076 Datasheet, PDF (1/2 Pages) Fairchild Semiconductor – New SPM 2 Package Mounting Guidance

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AN-9076
New SPM^® 2 Package Mounting Guidance
Mounting Guidance
This application note shows the electric spacing and
mounting guidance of new SPM^® 2 package.
Electric Spacing
The electric spacing specification of new SPM 2 package is
shown Table 1.
Table 1. SPM 2 Package Typical Electric Spacing
Location
Clearance
[mm]
Creepage
Distance
[mm]
Between Power Terminals
7.80
8.00
Between Control Terminals
3.05
6.85
Between Terminals & H/S
3.8
6.06
Mounting Method and Precautions
When installing a module to a heat sink, excessive uneven
fastening force might apply stress to the inside of chips,
which leads to damage or degradation of the device. Figure
1 shows recommended fastening order.
Figure 1. Mounting Screws Fastening Order:
Notes:
1. Do not apply excessive torque when mounting screws.
Too much torque may cause ceramic cracks as well as
destruction of screws and the heat sink.
2. Avoid tightening only one side at once. Figure 1 shows
the recommended torque order for mounting screws.
Uneven mounting can damage the ceramic substrate.
The pre-screwing torque needs to be set as 20~30% of
the maximum torque rating.
Table 2. Mounting Torque and Heat Sink Flatness Specifications
Parameter
Conditions
Device Flatness
See Figure 2
Heat Sink Flatness
See Figure 3
Mounting Torque
Screw: M4
Recommended 0.9 N m
Recommended 9.1 kgf∙cm
Weight
Note:
3. SEMS screws (include spring/plain washer, M4) are recommended.
Min.
0
-50
0.9
9.1
Limits
Typ.
1.0
10.1
50
Max.
+200
+100
1.5
15.1
Unit
μm
μm
N∙m
kgf∙cm
g
© 2013 Fairchild Semiconductor Corporation
Rev. 1.0.0 • 7/25/13
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