AN-9072 Datasheet, PDF (1/3 Pages) Fairchild Semiconductor – Smart Power Module Motion-SPM™

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AN-9072
Smart Power Module Motion-SPM™ in µMini-DIP SPM^
Mounting Guidance
Mounting Guidance
This application note shows the electric spacing and
mounting guidance of µMini-DIP SPM.
Electric Spacing
The electric spacing specification of µMini-DIP SPM is
shown in Table 1.
Table 1. Typical Electric Spacing of µMini-DIP SPM
Between Power Terminals
Clearance
[mm]
Creepage
Distance
[mm]
3.08
3.28
Between Control Terminals
2.35
4.95
Between Terminals & Heat Sink
2.05
2.05
Mounting Method and Precautions
When installing a module to a heat sink, excessive uneven
fastening force might apply stress to inside chips, which can
lead to damage or degradation of the device. An example of
recommended fastening order is shown in Figure 1.
Figure 1. Mounting Screws Fastening Order:
Pre-Screwing: 1 → 2; Final Screwing: 2 → 1
Notes:
1. Do not over torque when mounting screws. Excess
mounting torque may cause ceramic cracks, as well as
screw and heat-sink damage.
2. Avoid one-side tightening stress, Figure 1 shows the
recommended torque order for mounting screws.
Uneven mounting can cause the SPM ceramic
substrate to be damaged. The pre-screwing torque is
set to 20~30% of maximum torque rating.
Table 2. Mounting Torque and Heat Sink Flatness Specifications
Parameter
Conditions
Min.
Limits
Typ.
Device Flatness
Heat Sink Flatness
Mounting Torque
Weight
Screw: M3
See Figure 2
See Figure 3
Recommended 0.7N·m
Recommended 7.1kg·m
0
-50
0.6
0.7
6.2
7.1
11
Note:
3. Recommend using SEMS screw (include spring/plain washer, M3) in fastening screws.
Max.
+120
+100
0.8
8.1
Units
µm
µm
N·m
kg·cm
g
© 2009 Fairchild Semiconductor Corporation
Rev. 1.0.2 • 4/7/11
www.fairchildsemi.com