74LVTH373_08 Datasheet, PDF (1/10 Pages) Fairchild Semiconductor – Low Voltage Octal Transparent Latch with 3-STATE Outputs

February 2008
74LVT373, 74LVTH373
Low Voltage Octal Transparent Latch with 3-STATE Outputs
Features
■ Input and output interface capability to systems at
5V V_CC
■ Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH373),
also available without bushold feature (74LVT373)
■ Live insertion/extraction permitted
■ Power Up/Down high impedance provides glitch-free
bus loading
■ Outputs source/sink –32 mA/+64 mA
■ Functionally compatible with the 74 series 373
■ ESD performance:
– Human-body model > 2000V
– Machine model > 200V
– Charged-device model > 1000V
General Description
The LVT373 and LVTH373 consist of eight latches with
3-STATE outputs for bus organized system applications.
The latches appear transparent to the data when Latch
Enable (LE) is HIGH. When LE is LOW, the data satisfy-
ing the input timing requirements is latched. Data
appears on the bus when the Output Enable (OE) is
LOW. When OE is HIGH, the bus output is in a high
impedance state.
The LVTH373 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These octal latches are designed for low-voltage (3.3V)
V_CC applications, but with the capability to provide a TTL
interface to a 5V environment. The LVT373 and
LVTH373 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining low power dissipation.
Ordering Information
Package
Order Number Number
Package Description
74LVT373WM
M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LVT373SJ
74LVT373MTC
74LVTH373WM
74LVTH373SJ
M20D
MTC20
M20B
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVTH373MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
©1999 Fairchild Semiconductor Corporation
74LVT373, 74LVTH373 Rev. 1.5.0
www.fairchildsemi.com