74LVTH162374 Datasheet, PDF (1/8 Pages) Fairchild Semiconductor – Low Voltage 16-Bit D-Type Flip-Flop with 3-STATE Outputs and 25Ω Series Resistors in the Outputs

June 2000
Revised June 2005
74LVTH162374
Low Voltage 16-Bit D-Type Flip-Flop
with 3-STATE Outputs
and 25: Series Resistors in the Outputs
General Description
The LVTH162374 contains sixteen non-inverting D-type
flip-flops with 3-STATE outputs and is intended for bus ori-
ented applications. The device is byte controlled. A buff-
ered clock (CP) and Output Enable (OE) are common to
each byte and can be shorted together for full 16-bit opera-
tion.
The LVTH162374 is designed with equivalent 25: series
resistance in both the HIGH and LOW states of the output.
This design reduces line noise in applications such as
memory address drivers, clock drivers, and bus transceiv-
ers/transmitters.
The LVTH162374 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These flip-flops are designed for low-voltage (3.3V) V_CC
applications, but with the capability to provide a TTL inter-
face to a 5V environment. The LVTH162374 is fabricated
with an advanced BiCMOS technology to achieve high
speed operation similar to 5V ABT while maintaining a low
power dissipation.
Features
s Input and output interface capability to systems at
5V V_CC
s Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs
s Live insertion/extraction permitted
s Power Up/Power Down high impedance provides
glitch-free bus loading
s Outputs include equivalent series resistance of 25: to
make external termination resistors unnecessary and
reduce overshoot and undershoot
s Functionally compatible with the 74 series 16374
s Latch-up performance exceeds 500 mA
s ESD performance:
Human-body model ! 2000V
Machine model ! 200V
Charged-device model ! 1000V
s Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Ordering Code:
Order Number
Package
Number
Package Description
74LVTH162374GX
(Note 1)
BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
(Preliminary) [TAPE and REEL]
74LVTH162374MEA
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[TUBES]
74LVTH162374MEX
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[TAPE and REEL]
74LVTH162374MTD
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TUBES]
74LVTH162374MTX
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TAPE and REEL]
Note 1: BGA package available in Tape and Reel only.
© 2005 Fairchild Semiconductor Corporation DS500355
www.fairchildsemi.com