74LVT574_08 Datasheet, PDF (1/11 Pages) Fairchild Semiconductor – Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs

January 2008
74LVT574, 74LVTH574
Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
Features
■ Input and output interface capability to systems at
5V V_CC
■ Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH574),
also available without bushold feature (74LVT574)
■ Live insertion/extraction permitted
■ Power Up/Down high impedance provides glitch-free
bus loading
■ Outputs source/sink –32mA/+64mA
■ Functionally compatible with the 74 series 574
■ Latch-up performance exceeds 500mA
■ ESD performance:
– Human-body model > 2000V
– Machine model > 200V
– Charged-device model > 1000V
General Description
The LVT574 and LVTH574 are high-speed, low-power
octal D-type flip-flop featuring separate D-type inputs for
each flip-flop and 3-STATE outputs for bus-oriented
applications. A buffered Clock (CP) and Output Enable
(OE) are common to all flip-flops.
The LVTH574 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These octal flip-flops are designed for low-voltage (3.3V)
V_CC applications, but with the capability to provide a TTL
interface to a 5V environment. The LVT574 and
LVTH574 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining a low power dissipation.
Ordering Information
Package
Order Number Number
Package Description
74LVT574WM
74LVT574SJ
74LVT574MSA
M20B
M20D
MSA20
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74LVT574MTC
74LVTH574WM
74LVTH574SJ
74LVTH574MSA
74LVTH574MTC
MTC20
M20B
M20D
MSA20
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
©1999 Fairchild Semiconductor Corporation
74LVT574, 74LVTH574 Rev. 1.6.0
www.fairchildsemi.com