74LVT374 Datasheet, PDF (1/8 Pages) NXP Semiconductors – 3.3V Octal D-type flip-flop; positive-edge trigger 3-State

September 1999
Revised March 2005
74LVT374 • 74LVTH374
Low Voltage Octal D-Type Flip-Flop
with 3-STATE Outputs
General Description
The LVT374 and LVTH374 are high-speed, low-power
octal D-type flip-flops featuring separate D-type inputs for
each flip-flop and 3-STATE outputs for bus-oriented appli-
cations. A buffered Clock (CP) and Output Enable (OE) are
common to all flip-flops.
The LVTH374 data inputs include bushold, eliminating the
need for external pull-up resistors to hold unused inputs.
These octal flip-flops are designed for low-voltage (3.3V)
V_CC applications, but with the capability to provide a TTL
interface to a 5V environment. The LVT374 and LVTH374
are fabricated with an advanced BiCMOS technology to
achieve high speed operation similar to 5V ABT while
maintaining low power dissipation.
Features
s Input and output interface capability to systems at
5V V_CC
s Bus-Hold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH374),
also available without bushold feature (74LVT374).
s Live insertion/extraction permitted
s Power Up/Down high impedance provides glitch-free
bus loading
s Outputs source/sink 32 mA/64 mA
s Functionally compatible with the 74 series 374
s Latch-up performance exceeds 500 mA
s ESD performance:
Human-body model ! 2000V
Machine model ! 200V
Charged-device model ! 1000V
Ordering Code:
Order Number
Package
Number
Package Description
74LVT374WM
M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LVT374SJ
M20D Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVT374MTC
MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LVTH374WM
M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LVTH374SJ
M20D Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVTH374MTC
MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LVTH374MTCX_NL MTC20 Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
(Note 1)
Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
Logic Symbols
IEEE/IEC
© 2005 Fairchild Semiconductor Corporation DS012016
www.fairchildsemi.com