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74LCX374 Datasheet, PDF (1/12 Pages) STMicroelectronics – OCTAL D-TYPE FLIP FLOP NON INVERTING 3-STATE WITH 5V TOLERANT INPUTS AND OUTPUTS
February 1994
Revised March 2005
74LCX374
Low Voltage Octal D-Type Flip-Flop
with 5V Tolerant Inputs and Outputs
General Description
The LCX374 consists of eight D-type flip-flops featuring
separate D-type inputs for each flip-flop and 3-STATE out-
puts for bus-oriented applications. A buffered clock (CP)
and Output Enable (OE) are common to all flip-flops. The
LCX374 is designed for low voltage (3.3V or 2.5V) VCC
applications with capability of interfacing to a 5V signal
environment.
The LCX374 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintaining
CMOS low power dissipation.
Features
s 5V tolerant inputs and outputs
s 2.3V–3.6V VCC specifications provided
s 8.5 ns tPD max (VCC 3.3V), 10 PA ICC max
s Power-down high impedance inputs and outputs
s Supports live insertion/withdrawal (Note 1)
s r24 mA output drive (VCC 3.0V)
s Implements patented noise/EMI reduction circuitry
s Latch-up performance exceeds JEDEC 78 conditions
s ESD performance:
Human Body Model ! 2000V
Machine Model ! 200V
s Leadless Pb-Free DQFN package
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to VCC through a pull-up resistor: the minimum value or the
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Order Number
Package
Number
Package Description
74LCX374WM
M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LCX374SJ
M20D Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX374BQX
(Preliminary)
(Note 2)
MLP020B Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 4.5mm
74LCX374MSA
MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74LCX374MTC
MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LCX374MTCX_NL MTC20 Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
(Note 3)
Wide
Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Note 2: DQFN package available in Tape and Reel only.
Note 3: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
© 2005 Fairchild Semiconductor Corporation DS011996
www.fairchildsemi.com