74LCX245 Datasheet, PDF (1/12 Pages) Fairchild Semiconductor – Low Voltage Bidirectional Transceiver with 5V Tolerant Inputs and Outputs

February 1994
Revised March 2005
74LCX245
Low Voltage Bidirectional Transceiver
with 5V Tolerant Inputs and Outputs
General Description
The LCX245 contains eight non-inverting bidirectional buff-
ers with 3-STATE outputs and is intended for bus oriented
applications. The device is designed for low voltage (2.5V
and 3.3V) V_CC applications with capability of interfacing to
a 5V signal environment. The T/R input determines the
direction of data flow through the device. The OE input dis-
ables both the A and B ports by placing them in a high
impedance state.
The LCX245 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintaining
CMOS low power dissipation.
Features
s 5V tolerant inputs and outputs
s 2.3V to 3.6V V_CC specifications provided
s 7.0 ns t_PD max (V_CC 3.3V), 10 PA I_CC max
s Power down high impedance inputs and outputs
s Supports live insertion/withdrawal (Note 1)
s r24 mA output drive (V_CC 3.0V)
s Implements patented noise/EMI reduction circuitry
s Latch-up performance exceeds 500 mA
s ESD performance:
Human body model ! 2000V
Machine model ! 200V
s Leadless DQFN Pb-Free package
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to V_CC through a pull-up resistor: the minimum value or the
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Order Number
Package
Number
Package Description
74LCX245WM
(Note 2)
M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LCX245WMX_NL
(Note 4)
M20B Pb-Free 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LCX245SJ
(Note 2)
M20D Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX245BQX
(Note 3)
MLP020B Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 4.5mm
74LCX245MSA
(Note 2)
MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74LCX245MTC
(Note 2)
MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LCX245MTCX_NL MTC20 Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
(Note 4)
Wide
Pb-Free package per JEDEC J-STD-020B.
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Note 3: DQFN package available in Tape and Reel only.
Note 4: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
© 2005 Fairchild Semiconductor Corporation DS012006
www.fairchildsemi.com