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74LCX2244 Datasheet, PDF (1/11 Pages) Fairchild Semiconductor – Low Voltage Buffer/Line Driver with 5V Tolerant Inputs and Outputs with 26ohm Series Resistors in the Outputs
October 1995
Revised May 2003
74LCX2244
Low Voltage Buffer/Line Driver with 5V Tolerant Inputs
and Outputs with 26Ω Series Resistors in the Outputs
General Description
The LCX2244 contains eight non-inverting buffers with
3-STATE outputs. The device may be employed as a mem-
ory address driver, clock driver and bus-oriented transmit-
ter/receiver. The LCX2244 is designed for low voltage
(2.5V or 3.3V) VCC applications with capability of interfac-
ing to a 5V signal environment. The 26Ω series resistors
help reduce output overshoot and undershoot.
The LCX2244 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintaining
CMOS low power dissipation.
Features
s 5V tolerant inputs and outputs
s 2.3V to 3.6V VCC specifications provided
s 7.5 ns tPD max (VCC = 3.3V) 10 µA ICC max
s Power down high impedance inputs and outputs
s 26Ω-series resistors in the outputs
s Supports live insertion/withdrawal (Note 1)
s ±12 mA output drive (VCC = 3.0V)
s Implements patented noise/EMI reduction circuitry
s Latch-up performance exceeds 500 mA
s ESD performance:
Human body model > 2000V
Machine model > 200V
s Leadless DQFN package
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to VCC through a pull-up resistor: the minimum value or the
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Order Number
Package
Number
Package Description
74LCX2244WM
M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LCX2244SJ
M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX2244BQ MLP020B 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241,
(Preliminary)
(Preliminary) 2.5 x 4.5mm
74LCX2244MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74LCX2244MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
© 2003 Fairchild Semiconductor Corporation DS012569
www.fairchildsemi.com