2504023017Y0 Datasheet, PDF (1/3 Pages) Fair-Rite Products Corp. – MULTI-LAYER CHIP BEAD

Fair-Rite Products Corp. PO Box J,One Commercial Row, Wallkill, NY 12589-0288
Phone: [phone] www.fair-rite.com
Fair-Rite Product's Catalog
Part Data Sheet, 2504023017Y0
Printed: 2010-11-09
Part Number:
2504023017Y0
Frequency Range: Low Current
Description:
MULTI-LAYER CHIP BEAD
Application:
Suppression Components
Where Used:
Board Component
Part Type:
Chip Beads
Preferred Part:
Mechanical Specifications
Weight:
.002 (g)
Part Type Information
Fair-Rite offers a broad selection of cost effective multi-layer chip beads to suppress conducted EMI signals. Chip beads can be used
in an array of devices such as cellular phones, computers, laptops, pagers, etc. The small package sizes accommodate automated placements
and allow for a dense packaging of circuit boards. Chip beads are 100% tested for impedance and dc resistance. They are available in
standard, high and GHz signal speeds. The multi-layer chip beads are organized by increasing package size and current carrying capacity.
-All multi-layer chip beads are supplied taped and reeled, if required bulk packed chip beads can be provided.
-The impedance values listed are typical values. The nominal impedance with a ± 25% tolerance is specified for the + marked 100 MHz.
Chip beads are measured for impedance on the HP 4291A and fixture HP 16192A.
-Chip beads have plated contacts, 100% tin over a nickel undercoating. They can accommodate both reflow and wave soldering technologies.
-The suggested land patterns are in accordance to the latest revision of IPC-7351.
-Recommended storage and operating temperature range is -55°C to 125°C.
-Our 'Chip Bead Kit' (part number 0199000018) is available for prototype evaluation.