XRA1206 Datasheet, PDF (3/15 Pages) Exar Corporation – 8-BIT I2C/SMBUS GPIO EXPANDER

REV. 1.0.0
PIN DESCRIPTIONS
XRA1206
8-BIT I2C/SMBUS GPIO EXPANDER WITH INTEGRATED LEVEL SHIFTERS
Pin Description
NAME
QFN-16 TSSOP-16
TYPE
PIN#
PIN#
DESCRIPTION
I²C INTERFACE
SDA
13
SCL
12
IRQ#
11
A0
16
RESET#
1
15
I/O _I2_{C-bus data input/output (open-drain).}
14
I _I2_{C-bus serial input clock.}
13
OD _{Interrupt output (open-drain, active LOW).}
2
I _{This pin selects the I}2_{C slave address. See Table 1.}
3
I _{Reset (active LOW) - A longer than 40 ns LOW pulse on this pin will reset the}
internal registers and all GPIOs will be configured as inputs.
GPIOs
P0
2
4
P1
3
5
P2
4
6
P3
5
7
P4
7
9
P5
8
10
P6
9
11
P7
10
12
ANCILLARY SIGNALS
VCCP
14
16
VCC
15
1
GND
6
8
GND Center
-
Pad
I/O _{General purpose I/Os P0-P7. All GPIOs are configured as inputs upon power-}
I/O up or after a reset.
I/O
I/O
I/O
I/O
I/O
I/O
Pwr _{1.65V to 3.6V VCC supply voltage for GPIOs.}
Pwr _{1.65V to 3.6V VCC supply voltage for I}2_{C-bus interface.}
Pwr _{Power supply common, ground.}
Pwr _{The exposed pad at the bottom surface of the package is designed for thermal}
performance. Use of a center pad on the PCB is strongly recommended for ther-
mal conductivity as well as to provide mechanical stability of the package on the
PCB. The center pad is recommended to be solder masked defined with open-
ing size less than or equal to the exposed thermal pad on the package bottom to
prevent solder bridging to the outer leads of the device. Thermal vias must be
connected to GND plane as the thermal pad of package is at GND potential.
Pin type: I=Input, O=Output, I/O= Input/output, OD=Output Open Drain.
3