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XRP6658 Datasheet, PDF (2/11 Pages) Exar Corporation – 1A 1.5MHz PFM/PWM Synchronous Step-Down Converter
XRP6658
1A 1.5MHz PFM/PWM Synchronous Step-Down Converter
ABSOLUTE MAXIMUM RATINGS
These are stress ratings only and functional operation of
the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may affect
reliability.
Input Voltage VIN ...................................... -0.3V to 6.0V
EN, VFB Voltages .......................................... -0.3V to VIN
SW Voltage.................................... -0.3V to (VIN + 0.3V)
Storage Temperature .............................. -65°C to 150°C
Lead Temperature (Soldering, 10 sec) ................... 260°C
ESD Rating (HBM - Human Body Model) .................... 2kV
ESD Rating (MM - Machine Model) ...........................200V
Junction Temperature (Notes 1, 3) ....................... 150°C
OPERATING RATINGS
Input Voltage Range VIN...............................2.5V to 5.5V
Operating Temperature Range .................. -40°C to 85°C
Thermal Resistance ......................................................
θJA (5 Pin SOT23) .......................................134.5°C/W
θJC (5 Pin SOT23) ........................................... 81°C/W
ELECTRICAL SPECIFICATIONS
Specifications with standard type are for an Ambient Temperature of TA = 25°C only; limits applying over the full Operating
Temperature range are denoted by a “•”. Minimum and Maximum limits are guaranteed through test, design, or statistical
correlation. Typical values represent the most likely parametric norm at TA = 25°C, and are provided for reference purposes
only. Unless otherwise indicated, VIN = 3.6V, TA= 25°C.
Parameter
Input Voltage Range
Feedback Current
Regulated Feedback Voltage
Output Voltage Accuracy
Output Voltage Accuracy
Reference Voltage Line Regulation
Reference Voltage Line Regulation
Output Voltage Line Regulation
Output Voltage Line Regulation
Peak Inductor Current
PWM Quiescent Current (Note 2)
PFM Quiescent Current
Shutdown
Oscillator Frequency
Short-Circuit Oscillator Frequency
RDS(ON) of PMOS
RDS(ON) of NMOS
Under Voltage Lock Out
SW Leakage
Enable Threshold
Shutdown Threshold
EN Leakage Current
Min.
2.5
0.588
-3
-3
1.5
1.2
0.4
Typ.
0.600
2.3
188
15
0.1
1.5
900
0.24
0.21
1.8
Max.
5.5
+100
0.612
+3
+3
0.4
0.4
0.4
0.4
1
1.8
+1
1.2
+1
Units
V
nA
V
%
%
%/V
%/V
%/V
%/V
A
µA
µA
µA
MHz
kHz
Ω
Ω
V
µA
V
V
µA
Conditions
IOUT=100mA, VIN = 2.5V to 3.0V
• IOUT=100mA, VIN = 3.0V to 5.5V
VIN = 2.5V to 3.0V
• VIN = 3.0V to 5.5V
VIN = 2.5V to 3.0V
• VIN = 3.0V to 5.5V
VFB = 0.5V or VOUT = 90%
VFB = 0.5V or VOUT = 90%
VFB = 0.65V or VOUT = 108%
VRUN = 0V, VIN = 4.2V
• VFB = 0.6V or VOUT = 100%
• VFB = 0V or VOUT = 0V
ISW = 100mA
ISW = –100mA
VRUN = 0V, VSW = 0V or 5V, VIN = 5V
•
•
•
Note 1: TJ is a function of the ambient temperature TA and power dissipation PD: (TJ = TA + (PD * θJA))
Note 2: Dynamic quiescent current is higher due to the gate charge being delivered at the switching frequency.
Note 3: This IC is built-in over-temperature protection to avoid damage from overload conditions.
Note 4: θJA is measured in the natural convection at TA=25 on a high effective thermal conductivity test board (2 layers,
2S0P) of JEDEC 51-5 thermal measurement standard.
Note 5: θJC represents the resistance to the heat flows the chip to package top case.
© 2011 Exar Corporation
2/11
Rev. 1.5.0