SP619 Datasheet, PDF (2/7 Pages) Sipex Corporation – High Current Power Switch

ABSOLUTE MAXIMUM RATINGS
VIN……….…………………………….….…-0.3V to 7V
These are stress ratings only and functional op- _{Storage Temperature..…....……….… -65°C to 150°C}
eration of the device at these ratings or any other Junction Temperature..................... ……..…….150°C
above those indicated in the operation sections of ^{Lead Temperature (Soldering, 10 sec)......…….300°C}
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absolute maximum rating conditions for extended ^{Human Body Model……………………….…….2000V}
periods of time may affect reliability.
Machine Model…………………………………....200V
23(5$7,1*5$7,1*6
Thermal resistance SOT23-6
Junction to Ambient……………………….….….191°C
Junction to lead ……………………...……………50°C
RECOMMENDED OPERATING CONDITIONS
8QOHVVRWKHUZLVHVSHFL¿HG9IN = 4.5V - 5.5V, CIN = 0.1µF, TA = -10°C to + 85°C
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CONDITIONS
MIN TYP (Note 1)
MAX
UNITS
Operating Input Voltage
Range
4.5
5.5
V
Overcurrent Deactivation
Range
(1 9
620
800
1010
mA
Overcurrent Duration Be-
(1 9
1
fore Deactivation
5.25
ms
Shutdown Supply Current
VIN=4.5V
2
µA
Quiescent Supply Current
(1 99IN=4.5V
IOUT=0mA
350
µA
Quiescent Supply Current
(1 99IN=4.5V
IOUT=725mA
5.25
mA
RDS(ON)
VIN=4.5V IOUT=100mA
(1 9
.377
Ÿ
Post Fault Output Load for
Recovery
(QDEOH 9
10
15
23
.Ÿ
Post Fault Activation Turn
(QDEOH 9
1
On Time
55
ms
Thermal Shutdown Die
SP619 will self recover
120
150
Temperature
when temperature drops
below the trip point .
180
°C
Thermal Restart Die Tem-
perature
90
120
135
°C
(1$%/(/RJLF/2:
Driver is disabled
.5
V
(1$%/(3LQ/RJLF+,*+
Driver is active
.655
1.4
V
Turn On Delay
RL NŸ&L= 0.01µF
(Note 2,3)
600
µs
Turn Off Delay
RL NŸ&L= 0.01µF
(Note 2,4)
200
µs
Rise Time
RL NŸ&L= 0.01µF
(Note 2)
100
µs
Fall Time
RL NŸ&L= 0.01µF
(Note 2)
2500
µs
1RWH7\SLFDOVDUH7J=25°C
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1RWH7XUQRQGHOD\LVPHDVXUHGIURPWKHWLPHWKHHQDEOHSLQLVWXUQHGRQWRWKHWLPHLWWDNHVWKHRXWSXWWRULVHWRRILWV 
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1RWH7XUQRIIGHOD\LVPHDVXUHGIURPWKHWLPHWKHHQDEOHSLQLVWXUQHGWRWKHWLPHLWWDNHVIRUWKHRXWSXWWRIDOOWRRILWV 
current value.
April 2008 Rev L
SP619 High Current Power Switch
© 2008 EXAR Corporation
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