T2C9-1FJA Datasheet, PDF (9/9 Pages) Everlight Electronics Co., Ltd – designed for application required high luminous intensity

Technical Data Sheet
424/T2C9-1FJA
6. Soldering Condition
Careful attention should be paid during soldering. When soldering, leave more then 3mm from
solder joint to case, and soldering beyond the base of the tie bar is recommended.
Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly
when soldering.
Recommended soldering conditions:
Hand Soldering
400℃ Max. (30W
Temp. at tip of iron
Max.)
DIP Soldering
Preheat temp. 100℃ Max. (60 sec Max.)
Soldering time
3 sec Max.
Bath temp.
265 Max.
Distance
3mm Min.(From solder Bath time.
5 sec Max.
joint to case)
Distance
3mm Min.
EVERLIGHT ELECTRONICS CO., LTD.
Office: No 25, Lane 76, Sec 3, Chung Yang Rd,
Tucheng, Taipei 236, Taiwan, R.O.C
Tel: [phone]
Fax: [phone]
http:\\www.everlight.com
Everlight Electronics Co., Ltd.
Device Number DLE-042-094
http\\:www.everlight.com
Established date: 06-27-2007
Rev 1
Page: 9 of 9
Established by: Amy Ma