3474AN Datasheet, PDF (9/10 Pages) Everlight Electronics Co., Ltd – performance oval LED

Technical Data Sheet
„ Recommended soldering profile
3474AN/BADB-AFGA/XR/MS
laminar wave
Fluxing
Prehead
„ Avoiding applying any stress to the lead frame while the LEDs are at high temperature
particularly when soldering.
„ Dip and hand soldering should not be done more than one time
„ After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or
vibration until the LEDs return to room temperature.
„ A rapid-rate process is not recommended for cooling the LEDs down from the peak
temperature.
„ Although the recommended soldering conditions are specified in the above table, dip or
handsoldering at the lowest possible temperature is desirable for the LEDs.
„ Wave soldering parameter must be set and maintain according to recommended
temperature and dwell time in the solder wave.
4. Cleaning
„ When necessary, cleaning should occur only with isopropyl alcohol at room temperature
for a duration of no more than one minute. Dry at room temperature before use.
„ Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of
ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the
assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not
cause damage to the LED.
Everlight Electronics Co., Ltd.
Device Number :DT1-347-023
http\\:www.everlight.com
Prepared date: 03-24-2008
Rev 1
Page: 9 of 10
Prepared by: Grace Shen