204-15-T2C3-2LQA Datasheet, PDF (9/12 Pages) Everlight Electronics Co., Ltd – Popular T-1 round package

Technical Data Sheet
204-15/T2C3-2LQA
Notes
1. Lead Forming
 During lead formation, the leads should be bent at a point at least 3mm from the base of the
epoxy bulb.
 Lead forming should be done before soldering.
 Avoid stressing the LED package during leads forming. The stress to the base may damage
the LED’s characteristics or it may break the LEDs.
 Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures
may cause failure of the LEDs.
 When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead
position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration
of the epoxy resin and this will degrade the LEDs.
2. Storage
 The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from
Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or
more, they can be stored for a year in a sealed container with a nitrogen atmosphere and
moisture absorbent material.
 Please avoid rapid transitions in ambient temperature, especially, in high humidity
environments where condensation can occur.
3. Soldering
 Careful attention should be paid during soldering. When soldering, leave more then 3mm
from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is
recommended.
 Recommended soldering conditions:
Hand Soldering
Temp. at tip of
iron
300Ċ Max. (30W
Max.)
Soldering time
Distance
3 sec Max.
3mm Min.(From
solder joint to
epoxy bulb)
DIP Soldering
Preheat temp.
100Ċ Max. (60 sec
Max.)
Bath temp. & time
Distance
260 Max., 5 sec Max
3mm Min. (From
solder joint to epoxy
bulb)
Everlight Electronics Co., Ltd.
Device Number: DLE-0001243
Revision : 1
LifecyclePhase:
http\\:www.everlight.com
Rev 1
Page: 9 of 12
Established date:04-15-2009
Established by: Ruby Lin
Release Date:2009-04-17 09:06:22.0
Expired Period: Forever