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BADC-AGJA Datasheet, PDF (7/9 Pages) Everlight Electronics Co., Ltd – Technical Data Sheet | |||
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Technical Data Sheet
5484BN/BADC-AGJA/X/MS
 Recommended soldering conditions:
Hand Soldering
300â Max. (30W
Temp. at tip of iron
Max.)
Soldering time
3 sec Max.
Distance
3mm Min.(From
solder joint to
epoxy bulb)
DIP Soldering
Preheat temp.
100â Max. (60 sec
Max.)
Bath temp. & time 260 Max., 5 sec Max
Distance
3mm Min. (From
solder joint to epoxy
bulb)
 Recommended soldering profile
laminar wave
Fluxing
Prehead
 Avoiding applying any stress to the lead frame while the LEDs are at high temperature
particularly when soldering.
 Dip and hand soldering should not be done more than one time
 After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or
vibration until the LEDs return to room temperature.
 A rapid-rate process is not recommended for cooling the LEDs down from the peak
temperature.
Everlight Electronics Co., Ltd.
Device Number : DLE-0001237
http\\:www.everlight.com
Prepared date:04-15-2009
Rev 1
Page: 7 of 9
Prepared by: Grace Shen
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