ELSH-F81G1-0GPNM-CG1G2 Datasheet, PDF (24/45 Pages) Everlight Electronics Co., Ltd – Shuen

DATASHEET
SMD HP Shuen
1W Series
Reflow Soldering Characteristics
For Reflow Process
a. ELSH series are suitable for SMT processes.
b. Curing of glue in oven must be according to standard operation flow processes.
c. Reflow soldering should not be done more than twice.
d. In soldering process, stress on the LEDs during heating should be avoided.
e. After soldering, do not bend the circuit board.
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