30-01-B74-S3NC-C6T1U1DH Datasheet, PDF (13/16 Pages) Everlight Electronics Co., Ltd – 3mm Advanced Super Flux LEDs

DATASHEET
P-LED
30-01-B74-S3NC-C6T1U1DH-AM
Packing Quantity
Packing material Length × Width × height (mm) Tube Quantity (Pcs) LED Quantity (Pcs)
Tube
485 x 9.5 x12
1
60
Standard box
510 x 100 x 45
30
1800
Large box
510 x 150 x 90
105
6300
Note:
1. Normal packing specification is use standard box, unless already defined initially.
2. Vacuum packing with anti-static bag after packing in standard box.
3. Specifications are subject to change without prior notice.
Notes
1. Lead Forming
 During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy
bulb.
 Lead forming should be done before soldering.
 Avoid stressing the LED package during leads forming. The stress to the base may damage the
LED’s characteristics or it may break the LEDs.
 Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may
cause failure of the LEDs.
 When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead
position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the
epoxy resin and this will degrade the LEDs.
2. Storage
 The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight
and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be
stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.
 Please avoid rapid transitions in ambient temperature, especially, in high humidity environments
where condensation can occur.
3. Soldering
 Careful attention should be paid during soldering. Solder the LED no lower than 1.6mm from the
base of stopper is recommended.
 Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly
when soldering.
Revision : 3
Release Date:2013-05-29 16:04:22.0
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