EUP7907 Datasheet, PDF (11/13 Pages) Eutech Microelectronics Inc – 600mA High PSRR Low Dropout Linear Regulator

EUP7907
Application Information
Resistors Select
Choose R2=100k to optimize accuracy, power supply
rejection, noise and power consumption. And the R1 can
be chosen by:
R₁
=
R
2
(
V_OUT
V_REF
− 1)
(EQ. 2)
where V_REF is the internal reference voltage, which is
0.8V in EUP7907.
External Capacitor
Like other low-dropout regulator, the EUP7907 requires
external capacitors for stability. It is specifically
designed for low-ESR capacitors requiring minimum
PCB area and smallest components.
Input Capacitor
A 2.2uF capacitor is required between the VIN pin and
the GND pin. Place it as close as possible to the device.
There are no requirements for the ESR on the input
capacitor, but the tolerance and temperature coefficient
must be considered when selecting the capacitor to
ensure the capacitance will be 2.2uF over the whole
operating temperature range.
Output Capacitor
The EUP7907 is designed specifically to work with very
small ceramic output capacitors. A 2.2uF to 10uF with
5mΩ to 500mΩ ESR range is suitable in the EUP7907
application circuit. The ESR of a typical 2.2uF ceramic
capacitor is about 20mΩ, which easily meets the ESR
requirement for stability.
Capacitor Characteristics
More consideration should be taken when selecting the
capacitor because its capacitance can vary with
temperature. The capacitor type X7R or X5R, which
operates over a temperature range of -40 to +85 ,
will only vary within ±15%. Some large value ceramic
capacitors are manufactured with Z5U or T5V
temperature characteristics. Their capacitance can drop
by more than 50% as the temperature goes from 25 to
85 . Therefore the capacitor type X7R or X5R is
recommended in applications where the ambient
temperature will change significantly above or below
25 .
No Load Stability
The EUP7907 will remains stable and in regulation with
no external load. This is special important in CMOS
RAM keep-alive applications.
shutdown function and turns the pass element off. The
pass element turn on again after the junction temperature
cools by 30°C.
For continuous operation, do not exceed absolute
maximum operation junction temperature 125°C. The
power dissipation definition in device is:
( ) P_D = V_IN − V_OUT × I_OUT + V_IN × I_Q
(EQ.3)
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation can
be calculated by following formula :
P_D(MAX) = (T_J(MAX) − T_A ) θ_JA
(EQ.4)
Where T_J(MAX) is the maximum operation junction
temperature 125°C, TA is the ambient temperature and the
θ_JA is the junction to ambient thermal resistance.
For recommended operating conditions specification of
EUP7907, where T_J(MAX) is the maximum junction
temperature of the die (125°C) and T_A is the operated
ambient temperature. The junction to ambient thermal
resistance θ_JA is layout dependent. For SOT-23-5 package,
the thermal resistance θ_JA is 220°C/W on the standard
thermal test board. For TDFN-8 package, the thermal
resistance θ_JA is 60°C/W on the standard thermal test
board. The maximum power dissipation at T_A = 25°C can
be calculated by following formula :
P_D(MAX) = (125°C − 25°C) 220 = 0.455W
for SOT23-5 package
(EQ.5)
P_D(MAX) = (125°C − 25°C) 60 = 1.667W
(EQ.6)
for TDFN-8 package
The maximum power dissipation depends on operating
ambient temperature for fixed T_J(MAX) and thermal
resistance θ_JA. For EUP7907 packages, the Figure 5 of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power
allowed.
Thermal Considerations
Thermal protection limits power dissipation in
EUP7907.When the operation junction temperature
exceeds 170°C, the OTP circuit starts the thermal
Figure 5. Power Dissipation for EUP7907 Packages
The EUP7907 is available in two standard packages:
TDFN-8 and SOT23-5 packages.
DS7907 Ver 1.1 Oct . 2008
11