FMM5716X Datasheet, PDF (6/9 Pages) Eudyna Devices Inc – 60GHz Low Noise Amplifier

FMM5716X
60GHz Low Noise Amplifier
CHIP OUTLINE
VDD1
VDD2
VDD3
RFin
RFout
VGG1
VGG2
Bonding Pad Locations (Dimension in Micron Meters)
590
VGG3
470
120
0
0 80
510
830
1280
1460
Pad Dimensions
DC Pads; 80 x 80 µm
RF Pads; 80 x 60 µm
Unit; µm
Chip size; 1540 x 710 µm
Chip Thickness; 70 µm
6