FMM5715X Datasheet, PDF (6/10 Pages) Eudyna Devices Inc – 60GHz Power Amplifier

FMM5715X
60GHz Power Amplifier MMIC
CHIP OUTLINE
VDD1
VDD2
VDD3
RFin
RFout
VGG1
VGG2
VGG3
Bonding Pad Locations (Dimension in Micron Meters)
490
1105
800
1860
460
120
0
0 80
540
1010
1305
Pad Dimensions
DC Pads; 80 x 80 µm
RF Pads; 80 x 60 µm
6
2110
Unit; µm
Chip size; 2190 x 920 µm
Chip Thickness; 70 µm