FMM5118X Datasheet, PDF (6/6 Pages) Eudyna Devices Inc – 20-32GHz Doubler MMIC

FMM5118X
20-32GHz Doubler MMIC
2030
1760
V_GG
CHIP OUTLINE
Unit: µm
Chip Size: 2.14mm x 2.03mm
Chip Thickness: 110µm (Typ.)
Pad Dimensions: 1. fo IN: 80 x 160µm
2. V_GG: 100 x 100µm
3. 2x fo OUT: 80 x 160µm
4. V_DD1: 100 x 100µm
5. V_DD2: 80 x 80µm
675
440
fo IN
180
170
0
0 170 185
V_DD1
V_DD2
730 880
2x fo OUT
2005 2140
For further information please contact:
FUJITSU COMPOUND SEMICONDUCTOR, INC.
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San Jose, CA 95131-1138, U.S.A.
Phone: [phone]
FAX: [phone]
www.fcsi.fujitsu.com
FUJITSU QUANTUM DEVICES EUROPE LTD.
Network House
Norreys Drive
Maidenhead, Berkshire SL6 4FJ
United Kingdom
TEL: [phone]
FAX: [phone]
FUJITSU QUANTUM DEVICES
SINGAPORE PTE LTD.
Hong Kong Branch
Rm. 1101, Ocean Centre, 5 Canton Rd. Tsim Sha Tsui,
Kowloon, Hong Kong
TEL: [phone]
FAX: [phone]
CAUTION
Fujitsu Compound Semiconductor Products contain gallium arsenide
(GaAs) which can be hazardous to the human body and the environment.
For safety, observe the following procedures:
• Do not put this product into the mouth.
• Do not alter the form of this product into a gas, powder,
or liquid through burning, crushing, or chemical processing
as these by-products are dangerous to the human body
if inhaled, ingested, or swallowed.
• Observe government laws and company regulations
when discarding this product. This product must be
discarded in accordance with methods specified
by applicable hazardous waste procedures.
FUJITSU QUANTUM DEVICES LIMITED
Business Development Division
11th Floor, Hachioji Daiichi-Seimei Bldg.
3-20-6 Myojin-cho
Hachioji-city, Tokyo 192-0046, Japan
TEL: [phone]
FAX: [phone]
Fujitsu Limited reserves the right to change products and specifications without notice.
The information does not convey any license under rights of Fujitsu Limited or others.
© 2003 FUJITSU COMPOUND SEMICONDUCTOR, INC.
Printed in U.S.A. FCSI0502M200
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