FMM5703X Datasheet, PDF (4/4 Pages) Eudyna Devices Inc – 24-32GHz LNA MMIC

FMM5703X
24-32GHz LNA MMIC
1020
380
VDD1
CHIP OUTLINE
1030 1180
VDD2
VDD3
Unit: µm
RF IN
600
RF OUT
0
0 140
1420
Chip Size: 1.56mm x 1.16mm
Chip Thickness: 110µm(Typ.)
Pad Dimensions: 1. DC 80 x 80µm
2. RF 80 x 160µm
All Vdd pads are connected together
For further information please contact:
FUJITSU COMPOUND SEMICONDUCTOR, INC.
2355 Zanker Rd.
San Jose, CA 95131-1138, U.S.A.
Phone: [phone]
FAX: [phone]
www.fcsi.fujitsu.com
FUJITSU MICROELECTRONICS EUROPE, GmbH
Quantum Devices Division
Network House
Norreys Drive
Maidenhead, Berkshire SL6 4FJ
Phone:[phone]
FAX:[phone]
CAUTION
Fujitsu Compound Semiconductor Products contain gallium arsenide
(GaAs) which can be hazardous to the human body and the environment.
For safety, observe the following procedures:
• Do not ingest.
• Do not alter the form of this product into a gas, powder, or liquid
through burning, crushing, or chemical processing as these by-products
are dangerous to the human body if inhaled, ingested, or swallowed.
• Observe government laws and company regulations when discarding this
product. This product must be discarded in accordance with methods
specified by applicable hazardous waste procedures.
Fujitsu Limited reserves the right to change products and specifications without notice.
The information does not convey any license under rights of Fujitsu Limited or others.
© 2000 FUJITSU COMPOUND SEMICONDUCTOR, INC.
Printed in U.S.A. FCSI04009M200
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