FMM5117X Datasheet, PDF (4/4 Pages) Eudyna Devices Inc – 20-32GHz Downconverter MMIC

FMM5117X
20-32GHz Downconverter MMIC
2260
2045
1775
1690
RF
CHIP OUTLINE
V_DD1
V_DD2
Unit: µm
Chip Size: 3.085mm x 2.26mm
Chip Thickness: 110µm (Typ.)
LO _{Pad Dimensions: 1. RF: 80 x 160µm}
2. V_DD1: 80 x 80µm
3. V_DD2: 100 x 100µm
4. LO: 80 x 160µm
5. V_GG: 100 x 100µm
6. IF: 80 x 120µm
460
190
0
0190
V_GG
IF
1195
2135 2300 2865 3085
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CAUTION
Fujitsu Compound Semiconductor Products contain gallium arsenide
(GaAs) which can be hazardous to the human body and the environment.
For safety, observe the following procedures:
• Do not put this product into the mouth.
• Do not alter the form of this product into a gas, powder,
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if inhaled, ingested, or swallowed.
• Observe government laws and company regulations
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discarded in accordance with methods specified
by applicable hazardous waste procedures.
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© 2003 FUJITSU COMPOUND SEMICONDUCTOR, INC.
Printed in U.S.A. FCSI0502M200