FMM5059VF Datasheet, PDF (14/16 Pages) Eudyna Devices Inc – Ku Band Power Amplifier MMIC

FMM5059VF
Ku band Power Amplifier MMIC
■ Mounting Instructions for VF Package
1. Screw Mounting
(1) The flange of package may be attached using screws. Torque conditions are
shown in table 1.
Table 1. Recommended and Maximum Torque for Screw Mounting
Package
VF
Recommended
screw
M2.0
Recommended
Torque
10 N-cm (0.9 lb-in)
Maximum Torque
15 N-cm (1.3 lb-in)
(2) First, tighten the screws with a torque driver set to 5 N-cm.
(3) The surface finish of the heat sink should be better than 0.8 µm, and the surface
flatness must be better than 10 µm.
(4) Silicon based heat sink compounds should not be used for the thermal
conductive grease. They cause poor grounding of the source flange,
contamination and long term degradation of thermal resistance between the FET
package and heat sink.
2. Solder Mounting
(1) Recommended solder are Tin-Lead solder (63Sn/37Pb), Lead-Free solder (Sn-
3.0Ag-0.5Cu)*¹ or equivalent.
(2) For soldering, Tin-Lead solder (63Sn/37Pb) or Lead-Free solder (Sn-3.0Ag-
0.5Cu)*¹ shall be used. (*1: The figure displays with weight %. A predominantly
tin-rich alloy with 3.0% silver and 0.5% copper.)
(3) Recommended Flux is Rosin type with chlorine content: 0.2% or less and a low
halogen content. After soldering, the flux residue should be removed by
appropriate cleaning methods.
(4) The recommended soldering conditions are as follows:
Partial heating method (soldering iron, spot laser/air)
Product terminal temperature: 260 deg-C, max. 10 s./terminal or
400 deg-C, max. 3 s./terminal
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