F0513005L Datasheet, PDF (12/13 Pages) Eudyna Devices Inc – 3 Gb/s NRZ Data Rate Laser Diode Driver

3 Gb/s Laser Diode Driver
♦ Packaging
F0513005L
The F0513005L is in an 18-terminal ceramic LCC package about 300 mil square with
the lead pitch of 50 mil, achieving miniaturization and low cost. It is convenient for design-
ers to miniaturize the circuit area in the PCB owing to the leadless package with small
dimension.
The F0513005M packaged in an 18-lead ceramic MFP about 300 mil square with the
lead pitch of 40 mil is also available as another choice for this device, allowing to enhance
the flexibility of assembling design. It was originally developed by SEI to improve RF
performance and heat radiation. Compared with the LCC, the ground potential is stabler
at microwave frequency range and the thermal resistivity is smaller due to the metal-
based bottom structure made from CuW (an alloy of copper and tungsten) with a high
thermal conductivity. The electrical characteristics of both IC's are almost equal but the
system performance depends on the assembling design. The F0513005M is more suit-
able for application requiring very excellent eye pattern performance and severe thermal
stability.
♦ Precautions
Owing to their small dimensions, the GaAs FET's from which the F0513005L is designed
are easily damaged or destroyed if subjected to large transient voltages. Such transients
can be generated by power supplies when switched on if not properly decoupled. It is also
possible to induce spikes from static-electricity-charged operations or ungrounded equip-
ment.