 English |
|
|
|
|
|
|
|
| FMM5829X Datasheet, PDF (11/14 Pages) Eudyna Devices Inc – K-Band Power Amplifier MMIC | |||
| |||
| ◁ |
FMM5829X
K-Band Power Amplifier MMIC
â Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters)
2235
2115
2100
VDD1 VDD2 (VGG3)
0 120 450 800 1170
VDD3
1840
(VGG5) VDD5
2990 3430 3905 4025
2235
2040
RF-IN
1405
RF-OUT
1290
195
120
0
0 120 240
830 1170
VGG1 (VGG2) (VGG4)
1840
VDD4
195
0
2990 3430 3905 4025
(VGG6) VDD6
Chip Size : 4025±30um x 2235±30um
Chip Thickness : 60±20um
Bonding Pad Size :
RF-Pad : 120um x 80um
VGG-Pad : 80um x 80um
VDD-Pad : 100um x 100um
ï¼®ï½ï½ï½
: Gate voltage is required from either or both bonding pad( VGG1 or/and VGG2~6).
11
|
▷ |
German
Russian
Spanish
Italian
Polish
Chinese
Japanese
Korean
French
Portuguese