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| FMM5057X Datasheet, PDF (11/14 Pages) Eudyna Devices Inc – C-Band Power Amplifier MMIC | |||
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FMM5057X
C-Band Power Amplifier MMIC
â Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters)
0
3230
3105
3075
VGG
737 1204
VDD3
2000
VDD5
3545
4130
3230
3105
3075
RF-IN 1618
1618 RF-OUT
128
0
0
737 1204
VDD1 VDD2
2000
VDD4
128
0
3545
VDD6
4130
Chip Size : 4130±30um x 3230±30um
Chip Thickness : 70±20um
Bonding Pad Size :
RF-Pad : 120um x 240um
VDD Pad : 240um x 120um
VGG Pad : 120um x 120um
11
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